Science and Technology

Apr 25, 2018

UNIVERSITY PARK Pa. — A precise, chemical-free method for etching nanoscale features on silicon wafers has been developed by a team from Penn State and Southwest Jiaotong University and Tsinghua University in China. In standard lithography, a photosensitive film is…

Apr 18, 2018

by A'ndrea Elyse Messer UNIVERSITY PARK, Pa. — Perfection is not everything, according to an international team of researchers whose 2-D materials study shows that defects can enhance a material's physical, electrochemical, magnetic, energy and catalytic properties. "Electronic devices, like…

Dec 3, 2017

NSF funds research on driver and urban supply-chain networks to reduce congestion Pamela Krewson Wertz UNIVERSITY PARK, Pa. — The National Science Foundation (NSF) has awarded more than $446,000 for a new collaborative engineering project that will allow drivers to…